Superconducting Silica Gel Material for Providing Heat Dissipation Scheme for CPU/GPU

Product Details
Material: Silicone
Application: Medical, Industrial, New Energy Vehicle
Certification: ISO, REACH, RoHS, IATF16949
Shipping & Policy
Shipping Cost: Contact the supplier about freight and estimated delivery time.
Payment Methods:
visa mastercard discover JCB diners club american express T/T
PIX SPEI OXXO PSE OZOW
  Support payments in USD
Secure payments: Every payment you make on Made-in-China.com is protected by the platform.
Refund policy: Claim a refund if your order doesn't ship, is missing, or arrives with product issues.
Manufacturer/Factory & Trading Company

360° Virtual Tour

Secured Trading Service
Gold Member Since 2023

Suppliers with verified business licenses

Audited Supplier

Audited by an independent third-party inspection agency

High Repeat Buyers Choice
More than 50% of buyers repeatedly choose the supplier
Fast Delivery
The supplier can deliver the goods within 15 days
Quality Assurance
The supplier provides quality assurance
Product Certification
The supplier's products already have relevant certification qualifications, including:
UL
to see all verified strength labels (28)
  • Superconducting Silica Gel Material for Providing Heat Dissipation Scheme for CPU/GPU
  • Superconducting Silica Gel Material for Providing Heat Dissipation Scheme for CPU/GPU
  • Superconducting Silica Gel Material for Providing Heat Dissipation Scheme for CPU/GPU
  • Superconducting Silica Gel Material for Providing Heat Dissipation Scheme for CPU/GPU
  • Superconducting Silica Gel Material for Providing Heat Dissipation Scheme for CPU/GPU
  • Superconducting Silica Gel Material for Providing Heat Dissipation Scheme for CPU/GPU
Find Similar Products
  • Overview
  • Features
  • Detailed Photos
  • Product Parameters
  • FAQ
  • About Us
Overview

Basic Info.

Model NO.
GC-TP-150A
Thickness
0.5-50mm
One Piece Size
210*410mm/320*320mm
Storage
Shady, Ordinary Temperature
Pertormance
Insulatiosel-Adhesvesoft
After-Sale Service
7*24hour Service
Special Services
One- Stop Solution
Transport Package
Shipping/Rail/Express
Specification
210*410mm/320*320mm/Customizable shapes patterns
Trademark
Gold-cool
Origin
China
HS Code
3284999999
Production Capacity
80000m2/Mon

Packaging & Delivery

Package Size
43.00cm * 27.00cm * 10.00cm
Package Gross Weight
180.000kg

Product Description



Superconducting Silica Gel Material for Providing Heat Dissipation Scheme for CPU/GPU



No matter use what kind of cooling device, if there is a poor fit between electronic components and cooling devices, it will have a lot of air block heat transmission between components. The cooling device will not be able to effectively reduce the heat of electronic components.
This series of products have very good thermal conductivity and filling properties, its softness, elastic characteristics can fill the gap well between heating component and the heat dissipation module, the gap between the metal body and chassis , fast heat dissipation, to promote the work efficiency of components, to extend the service life of equipment. 

Features

 

Superconducting Silica Gel Material for Providing Heat Dissipation Scheme for CPU/GPU
1.Good thermal performance.
2.Soft and high compressibility, vibration shock absorber.
3.Self-adhesive.
4.Easy construction.
5.Electrical insulation
6.Complies ROHS and UL environmental requirements.
7.Provide a variety of thickness to choose.


Application:

Integrated circuits, CPU, graphics processing chip, power electronic capacitors, crystal.Diode lights,power supply module, server, the hard disk.Plasma displays, LCD monitor, tablet computers,desktop computers, communications equipment, router.Memory module, video player, smart phone
 

Detailed Photos

Superconducting Silica Gel Material for Providing Heat Dissipation Scheme for CPU/GPUSuperconducting Silica Gel Material for Providing Heat Dissipation Scheme for CPU/GPUIn terms of thermal conductivity, shape, and size, we can customize according to customers' needs to meet the requirements of different devices and application scenarios. Whether you wish for a specific hardness of the silicone pad, or need a silicone pad of a particular shape and size, we have the capability to provide you with a fitting solution.

 

Product Parameters

General Product Attribute Table
Color - Blue Light blue+Yellow Visual
Project Unit GC-TP-150A GC-TP-200A6 GC-TP-200A GC-TP-200E6 Testing Standard
Hardess Shore oo 40±5 25±5 45/55 ±5 25±5 ASTM D2240
Thickness mm 0.5~50     0.5~50 ASTM D374
Density g/cm3 2.1±0.2 2.4±0.2 2.4±0.2 ASTM D792
Thermal Conductive W/m.k 1.5±0.2 2±0.2 2.0±0.2 ASTM D5470
Size mm Customizable   -
Thermogravimetric Loss % <1.0   @150ºC/24H
Tensile Strength MPa 0.08-0.32   ASTM D412
Volume Resistivity Ω.cm 1.0*1013   ASTM D257
Dielectric Strength KV/mm >6   ASTM D149
Flame Rating - V-0   UL94
Temperature Range ºC -40~200   -
 

FAQ

Superconducting Silica Gel Material for Providing Heat Dissipation Scheme for CPU/GPU

About Us

Superconducting Silica Gel Material for Providing Heat Dissipation Scheme for CPU/GPUSuperconducting Silica Gel Material for Providing Heat Dissipation Scheme for CPU/GPUSuperconducting Silica Gel Material for Providing Heat Dissipation Scheme for CPU/GPUSuperconducting Silica Gel Material for Providing Heat Dissipation Scheme for CPU/GPU
Superconducting Silica Gel Material for Providing Heat Dissipation Scheme for CPU/GPUSuperconducting Silica Gel Material for Providing Heat Dissipation Scheme for CPU/GPUSuperconducting Silica Gel Material for Providing Heat Dissipation Scheme for CPU/GPUSuperconducting Silica Gel Material for Providing Heat Dissipation Scheme for CPU/GPUSuperconducting Silica Gel Material for Providing Heat Dissipation Scheme for CPU/GPU                                                                                                                                                                                                                                 >>> know more

Superconducting Silica Gel Material for Providing Heat Dissipation Scheme for CPU/GPUSuperconducting Silica Gel Material for Providing Heat Dissipation Scheme for CPU/GPUSuperconducting Silica Gel Material for Providing Heat Dissipation Scheme for CPU/GPUSuperconducting Silica Gel Material for Providing Heat Dissipation Scheme for CPU/GPUSuperconducting Silica Gel Material for Providing Heat Dissipation Scheme for CPU/GPU





 

Send your message to this supplier

*From:
*To:
*Message:

Enter between 20 to 4,000 characters.

This is not what you are looking for? Post a Sourcing Request Now
Contact Supplier