| Material: | Organic Silicone |
|---|---|
| Application: | Medical, Industrial, New Energy Vehicle |
| Certification: | ISO, REACH, RoHS, IATF16949 |
| Advantage 1: | Electrical Insulation |
| Advantage 2: | Applied for Automatic Production Line |
| Advantage 3: | Low Compression Applications |
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Audited Supplier The Gap filler double component GC-TA350 is a high-quality heat dissipation compound designed for automated production lines. It offers excellent operability, a short curing time, and easy storage, making it a reliable choice for various industries including new energy, energy storage, network communications, security, and medical sectors.
This thermal conductive gel is known for its high thermal conductivity, low thermal resistance, and good thixotropy. It can be easily applied manually or integrated into automated production lines, providing versatility and convenience.
With its exceptional performance, the GC-TA350 gel can effectively replace the CGW-3 gel from the renowned Sekisui brand in Japan, ensuring reliable heat dissipation and thermal management.
This Heat Dissipation Compound is specifically designed for use in automated production lines. It offers high thermal conductivity, making it ideal for applications that require efficient heat dissipation. The compound also provides excellent electrical insulation, ensuring the safety and reliability of electronic components.
With superior temperature resistance, this compound can withstand high heat environments without compromising its performance. It is suitable for a wide range of applications, including LED chips, communication equipment, phone CPUs, memory modules, IGBJ and other power modules, power semiconductor field, new energy and energy storage systems, and various other electronic components.
Developed by Dongguan Gold-Cool Nano Technology Co., Ltd, a leading manufacturer in the field, this Heat Dissipation Compound is known for its precision and reliability. It is a versatile thermal conductive material that can be easily applied in automated production lines, ensuring efficient and consistent heat dissipation.
The Heat Dissipation Compound for Automatic Production Line, developed by Dongguan Gold-Cool Nano Technology Co., Ltd, is a high-quality thermal conductive gel designed for low stress and high compression modulus applications. This bi-component silicone product is perfect for use in automated production lines, where it can be closely contacted with electric products during assembly.
With its low contact thermal resistance and excellent electrical insulation properties, this thermal conductive gel ensures efficient heat dissipation and reliable thermal management. It is specifically formulated to provide optimal performance in high-temperature environments, making it suitable for a wide range of applications, including industrial control equipment, electric vehicle batteries, and drones.
The Heat Dissipation Compound for Automatic Production Line is a versatile thermal conductive material that offers exceptional thermal conductivity. Its precision steel mesh gel formulation ensures reliable and consistent performance, while its automated production adhesive gel properties make it easy to use in manufacturing processes.
Experience the benefits of this high-quality silicone product for thermal management. Enhance the performance and longevity of your electronic devices with the Heat Dissipation Compound for Automatic Production Line.
| General Product Attribute Table | |||||
| Two component thermal gel | |||||
| Project | Unit | TA200 | TA301 | TA350 | Testing Standard |
| Color | - | Whith+Light Blue | Yellow/Grey | Whith+Pink | Visual |
| Density | g/cm3 | 2.5±0.2 | 3.3±0.2 | 3.1±0.2 | ASTM D792 |
| Thermal Conductive | W/m.k | 2±0.2 | 3±0.2 | 3.5±0.3 | ASTM D5470 |
| Extrusion rate | g/min | 18 | 60 | 31 | @90psi 50cc Rubber hose |
| Hardess | Shore oo | 55±10 | 60±10 | ASTM D2240 | |
| Curing time | Min@25ºC | 30~60 | Visual | ||
| Temperature Range | ºC | -40~180 | - | ||
| Thermogravimetric Loss | % | 1 | @150ºC/24H | ||
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