• Thermal Conductive Silicon Chip Coefficient Power Supply CPU High Temperature Conductive Soft Heat Dissipation Insulation Gasket
  • Thermal Conductive Silicon Chip Coefficient Power Supply CPU High Temperature Conductive Soft Heat Dissipation Insulation Gasket
  • Thermal Conductive Silicon Chip Coefficient Power Supply CPU High Temperature Conductive Soft Heat Dissipation Insulation Gasket
  • Thermal Conductive Silicon Chip Coefficient Power Supply CPU High Temperature Conductive Soft Heat Dissipation Insulation Gasket
  • Thermal Conductive Silicon Chip Coefficient Power Supply CPU High Temperature Conductive Soft Heat Dissipation Insulation Gasket
  • Thermal Conductive Silicon Chip Coefficient Power Supply CPU High Temperature Conductive Soft Heat Dissipation Insulation Gasket

Thermal Conductive Silicon Chip Coefficient Power Supply CPU High Temperature Conductive Soft Heat Dissipation Insulation Gasket

Application: Insulators, Electrical Winding Insulation, Thermal Silicone Pad
Type: Insulation Sheet
Chemistry: Thermal Silicone Pad
Material: Silicone
Thermal Rating: -40~200
Maximum Voltage: 10KV~20KV
Manufacturer/Factory & Trading Company

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Guangdong, China
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  • Overview
  • Features
  • Detailed Photos
  • Product Parameters
  • FAQ
  • About Us
Overview

Basic Info.

Model NO.
GC-TP-100E3
Classification
Thermal Silicone Pad
Certification
ISO9001, ISO14001 If16949 RoHS Reach
Color
Green+Yellow
Brand
Gold-Cool
One Piece Size
210*410mm/320*320mm
Thickness
0.5-50mm
Storage
Shady, Ordinary Temperature
Performance
Insulation,Self-Adhesive,Soft
After-Sale Service
7*24hour Service
Special Services
One-Stop Solution
Transport Package
Ship/Rail/Express
Specification
210*410/320*320/Customizable size and shape
Trademark
gold-cool
Origin
Dongguan
HS Code
3284999999
Production Capacity
80000m2/Mon

Product Description






Thermal Conductive Silicon Chip Coefficient Power Supply CPU High Temperature Conductive Soft Heat Dissipation Insulation Gasket



No matter use what kind of cooling device, if there is a poor fit between electronic components and cooling devices, it will have a lot of air block heat transmission between components. The cooling device will not be able to effectively reduce the heat of electronic components.
This series of products have very good thermal conductivity and filling properties, its softness, elastic characteristics can fill the gap well between heating component and the heat dissipation module, the gap between the metal body and chassis , fast heat dissipation, to promote the work efficiency of components, to extend the service life of equipment. 

Features

 

Thermal Conductive Silicon Chip Coefficient Power Supply CPU High Temperature Conductive Soft Heat Dissipation Insulation Gasket
1.Good thermal performance.
2.Soft and high compressibility, vibration shock absorber.
3.Self-adhesive.
4.Easy construction.
5.Electrical insulation
6.Complies ROHS and UL environmental requirements.
7.Provide a variety of thickness to choose.


Application:

Integrated circuits, CPU, graphics processing chip, power electronic capacitors, crystal.Diode lights,power supply module, server, the hard disk.Plasma displays, LCD monitor, tablet computers,desktop computers, communications equipment, router.Memory module, video player, smart phone
 

Detailed Photos

Thermal Conductive Silicon Chip Coefficient Power Supply CPU High Temperature Conductive Soft Heat Dissipation Insulation GasketThermal Conductive Silicon Chip Coefficient Power Supply CPU High Temperature Conductive Soft Heat Dissipation Insulation Gasket
In terms of thermal conductivity, shape, and size, we can customize according to customers' needs to meet the requirements of different devices and application scenarios. Whether you wish for a specific hardness of the silicone pad, or need a silicone pad of a particular shape and size, we have the capability to provide you with a fitting solution.

 

Product Parameters

General Product Attribute Table
Color - Light Green Light Green+Yellow Visual
Project Unit GC-TP-100A3 GC-TP-100E3 Testing Standard
Hardess Shore oo 25±5   ASTM D2240
Thickness mm 0.5~50   ASTM D374
Density g/cm3 1.8±0.2 ASTM D792
Thermal Conductive W/m.k 1±0.2 ASTM D5470
Size mm Customizable -
Thermogravimetric Loss % <1.0 @150ºC/24H
Tensile Strength MPa 0.08-0.32 ASTM D412
Volume Resistivity Ω.cm 1.0*1013 ASTM D257
Dielectric Strength KV/mm >6 ASTM D149
Flame Rating - V-0 UL94
Temperature Range ºC -40~200 -
 

FAQ

Thermal Conductive Silicon Chip Coefficient Power Supply CPU High Temperature Conductive Soft Heat Dissipation Insulation Gasket

About Us

Thermal Conductive Silicon Chip Coefficient Power Supply CPU High Temperature Conductive Soft Heat Dissipation Insulation GasketThermal Conductive Silicon Chip Coefficient Power Supply CPU High Temperature Conductive Soft Heat Dissipation Insulation GasketThermal Conductive Silicon Chip Coefficient Power Supply CPU High Temperature Conductive Soft Heat Dissipation Insulation GasketThermal Conductive Silicon Chip Coefficient Power Supply CPU High Temperature Conductive Soft Heat Dissipation Insulation Gasket
Thermal Conductive Silicon Chip Coefficient Power Supply CPU High Temperature Conductive Soft Heat Dissipation Insulation GasketThermal Conductive Silicon Chip Coefficient Power Supply CPU High Temperature Conductive Soft Heat Dissipation Insulation GasketThermal Conductive Silicon Chip Coefficient Power Supply CPU High Temperature Conductive Soft Heat Dissipation Insulation GasketThermal Conductive Silicon Chip Coefficient Power Supply CPU High Temperature Conductive Soft Heat Dissipation Insulation GasketThermal Conductive Silicon Chip Coefficient Power Supply CPU High Temperature Conductive Soft Heat Dissipation Insulation Gasket                                                                                                                                                                                                                                 >>> know more

Thermal Conductive Silicon Chip Coefficient Power Supply CPU High Temperature Conductive Soft Heat Dissipation Insulation GasketThermal Conductive Silicon Chip Coefficient Power Supply CPU High Temperature Conductive Soft Heat Dissipation Insulation GasketThermal Conductive Silicon Chip Coefficient Power Supply CPU High Temperature Conductive Soft Heat Dissipation Insulation GasketThermal Conductive Silicon Chip Coefficient Power Supply CPU High Temperature Conductive Soft Heat Dissipation Insulation GasketThermal Conductive Silicon Chip Coefficient Power Supply CPU High Temperature Conductive Soft Heat Dissipation Insulation Gasket





 

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Diamond Member Since 2023

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Manufacturer/Factory & Trading Company
Number of Employees
44
Year of Establishment
2013-04-11