2.0W CPU Chip Heat Dissipation Silicone Pad, Notebook Insulation Heat-Resistant Flame-Retardant Conductive Silicone Film

Product Details
Application: Insulators, Electrical Winding Insulation, Winding Wire Coating Insulation, Electrical Base, Shell, Motor, Switch Baseplate, Thermal Silicone Pad
Color: Blue
Material: Silicone
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  • 2.0W CPU Chip Heat Dissipation Silicone Pad, Notebook Insulation Heat-Resistant Flame-Retardant Conductive Silicone Film
  • 2.0W CPU Chip Heat Dissipation Silicone Pad, Notebook Insulation Heat-Resistant Flame-Retardant Conductive Silicone Film
  • 2.0W CPU Chip Heat Dissipation Silicone Pad, Notebook Insulation Heat-Resistant Flame-Retardant Conductive Silicone Film
  • 2.0W CPU Chip Heat Dissipation Silicone Pad, Notebook Insulation Heat-Resistant Flame-Retardant Conductive Silicone Film
  • 2.0W CPU Chip Heat Dissipation Silicone Pad, Notebook Insulation Heat-Resistant Flame-Retardant Conductive Silicone Film
  • 2.0W CPU Chip Heat Dissipation Silicone Pad, Notebook Insulation Heat-Resistant Flame-Retardant Conductive Silicone Film
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  • Overview
  • Features
  • Detailed Photos
  • Product Parameters
  • FAQ
  • About Us
Overview

Basic Info.

Model NO.
GC-TP-200A
Maximum Voltage
10KV~20KV
Thermal Rating
-40~200
Thickness
0.5-50mm
UV Protection
No
One Piece Size
210*410mm/320*320mm
Storage
Shady, Ordinary Temperature
Pertormance
Insulatiosel-Adhesvesoft
After-Sale Service
7*24hour Service
Special Services
One- Stop Solution
Type
Insulation Sheet
Certification
ISO9001, ISO14001 IATF16949 RoHS Reach
Chemistry
Thermal Pad
Classification
Thermal Pad
Brand
Gold-Cool
Transport Package
Shipping/Rail/Express
Specification
210*410mm/320*320mm/Customizable shapes patterns
Trademark
Gold-cool
Origin
China
HS Code
3284999999
Production Capacity
80000m2/Mon

Product Description


2.0W CPU Chip Heat Dissipation Silicone Pad, Notebook Insulation Heat-Resistant Flame-Retardant Conductive Silicone Film



No matter use what kind of cooling device, if there is a poor fit between electronic components and cooling devices, it will have a lot of air block heat transmission between components. The cooling device will not be able to effectively reduce the heat of electronic components.
This series of products have very good thermal conductivity and filling properties, its softness, elastic characteristics can fill the gap well between heating component and the heat dissipation module, the gap between the metal body and chassis , fast heat dissipation, to promote the work efficiency of components, to extend the service life of equipment. 

Features

 

2.0W CPU Chip Heat Dissipation Silicone Pad, Notebook Insulation Heat-Resistant Flame-Retardant Conductive Silicone Film
1.Good thermal performance.
2.Soft and high compressibility, vibration shock absorber.
3.Self-adhesive.
4.Easy construction.
5.Electrical insulation
6.Complies ROHS and UL environmental requirements.
7.Provide a variety of thickness to choose.


Application:

Integrated circuits, CPU, graphics processing chip, power electronic capacitors, crystal.Diode lights,power supply module, server, the hard disk.Plasma displays, LCD monitor, tablet computers,desktop computers, communications equipment, router.Memory module, video player, smart phone
 

Detailed Photos

2.0W CPU Chip Heat Dissipation Silicone Pad, Notebook Insulation Heat-Resistant Flame-Retardant Conductive Silicone Film2.0W CPU Chip Heat Dissipation Silicone Pad, Notebook Insulation Heat-Resistant Flame-Retardant Conductive Silicone FilmIn terms of thermal conductivity, shape, and size, we can customize according to customers' needs to meet the requirements of different devices and application scenarios. Whether you wish for a specific hardness of the silicone pad, or need a silicone pad of a particular shape and size, we have the capability to provide you with a fitting solution.

 

Product Parameters

General Product Attribute Table
Color - Blue Light blue+Yellow Visual
Project Unit GC-TP-150A GC-TP-200A6 GC-TP-200A GC-TP-200E6 Testing Standard
Hardess Shore oo 40±5 25±5 45/55 ±5 25±5 ASTM D2240
Thickness mm 0.5~50     0.5~50 ASTM D374
Density g/cm3 2.1±0.2 2.4±0.2 2.4±0.2 ASTM D792
Thermal Conductive W/m.k 1.5±0.2 2±0.2 2.0±0.2 ASTM D5470
Size mm Customizable   -
Thermogravimetric Loss % <1.0   @150ºC/24H
Tensile Strength MPa 0.08-0.32   ASTM D412
Volume Resistivity Ω.cm 1.0*1013   ASTM D257
Dielectric Strength KV/mm >6   ASTM D149
Flame Rating - V-0   UL94
Temperature Range ºC -40~200   -
 

FAQ

2.0W CPU Chip Heat Dissipation Silicone Pad, Notebook Insulation Heat-Resistant Flame-Retardant Conductive Silicone Film

About Us

2.0W CPU Chip Heat Dissipation Silicone Pad, Notebook Insulation Heat-Resistant Flame-Retardant Conductive Silicone Film2.0W CPU Chip Heat Dissipation Silicone Pad, Notebook Insulation Heat-Resistant Flame-Retardant Conductive Silicone Film2.0W CPU Chip Heat Dissipation Silicone Pad, Notebook Insulation Heat-Resistant Flame-Retardant Conductive Silicone Film2.0W CPU Chip Heat Dissipation Silicone Pad, Notebook Insulation Heat-Resistant Flame-Retardant Conductive Silicone Film
2.0W CPU Chip Heat Dissipation Silicone Pad, Notebook Insulation Heat-Resistant Flame-Retardant Conductive Silicone Film2.0W CPU Chip Heat Dissipation Silicone Pad, Notebook Insulation Heat-Resistant Flame-Retardant Conductive Silicone Film2.0W CPU Chip Heat Dissipation Silicone Pad, Notebook Insulation Heat-Resistant Flame-Retardant Conductive Silicone Film2.0W CPU Chip Heat Dissipation Silicone Pad, Notebook Insulation Heat-Resistant Flame-Retardant Conductive Silicone Film2.0W CPU Chip Heat Dissipation Silicone Pad, Notebook Insulation Heat-Resistant Flame-Retardant Conductive Silicone Film                                                                                                                                                                                                                                 >>> know more

2.0W CPU Chip Heat Dissipation Silicone Pad, Notebook Insulation Heat-Resistant Flame-Retardant Conductive Silicone Film2.0W CPU Chip Heat Dissipation Silicone Pad, Notebook Insulation Heat-Resistant Flame-Retardant Conductive Silicone Film2.0W CPU Chip Heat Dissipation Silicone Pad, Notebook Insulation Heat-Resistant Flame-Retardant Conductive Silicone Film2.0W CPU Chip Heat Dissipation Silicone Pad, Notebook Insulation Heat-Resistant Flame-Retardant Conductive Silicone Film2.0W CPU Chip Heat Dissipation Silicone Pad, Notebook Insulation Heat-Resistant Flame-Retardant Conductive Silicone Film




 

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