• Mobile Hard Disk Phone Thermal Gap Filler
  • Mobile Hard Disk Phone Thermal Gap Filler
  • Mobile Hard Disk Phone Thermal Gap Filler
  • Mobile Hard Disk Phone Thermal Gap Filler
  • Mobile Hard Disk Phone Thermal Gap Filler
  • Mobile Hard Disk Phone Thermal Gap Filler

Mobile Hard Disk Phone Thermal Gap Filler

Material: Organic Silicone
Application: Medical, Industrial, New Energy Vehicle
Certification: ISO, REACH, RoHS, IATF16949
Advantage 1: Electrical Insulation
Advantage 2: Applied for Automatic Production Line
Advantage 3: Low Compression Applications
Manufacturer/Factory & Trading Company

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Guangdong, China
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  • Overview
  • Features
  • Detailed Photos
  • Product Parameters
  • FAQ
  • About Us
Overview

Basic Info.

Model NO.
GC-TA350
Advantage 4
Superior Temperature Resistance
After-Sale Service
7*24hour Service
Special Services
One-Stop Solution
Transport Package
Shipping/Rail/Express
Specification
50ml/stick 400ml/stick 36L/barrel
Trademark
Gold-cool
Origin
China
HS Code
3506990000
Production Capacity
50t/Mon

Product Description

mobile hard disk phone thermal gap filler
 

The Gap filler double component GC-TA350 has excellent operability, short curing time, and is easy to store. It is widely used in new energy, energy storage, network communications, security, and medical industries. The product features high thermal conductivity, low thermal resistance, and good thixotropy. It can be manually operated and is also suitable for automated production lines.And can replace the CGW-3 of Sekisui brand in Japan..

Features

 

Mobile Hard Disk Phone Thermal Gap Filler
1.High thermal conductivity 
2.Low compression applications
3.Excellent electrical insulation
4.Superior temperature resistance
5.Applied for automatic production line






Application:

1.LED chips
2.Comunication eauipment
3.Phone CUP
4.Memory module
5.IGBJ and other power modules
6.Power semiconductor field
7.New Energy/Energy Storage
Other electronic components
 

Detailed Photos

Mobile Hard Disk Phone Thermal Gap FillerMobile Hard Disk Phone Thermal Gap Filler
Thermal conductive gel is a bi-component preforming thermal conductive sulicone product with the applications for low stress and high compression modulus. Thermal conductive gel can be used in automatic production line and contacted closely with electric products when assembling with low contact thermal resistance and excellent electrical insulaition properties.

Product Parameters

General Product Attribute Table
Two component thermal gel
Project Unit TA200 TA301 TA350 Testing Standard
Color - Whith+Light Blue Yellow/Grey Whith+Pink Visual
Density g/cm3 2.5±0.2 3.3±0.2 3.1±0.2 ASTM D792
Thermal Conductive W/m.k 2±0.2 3±0.2 3.5±0.3 ASTM D5470
Extrusion rate g/min 18 60 31 @90psi 50cc Rubber hose
Hardess Shore oo 55±10 60±10 ASTM D2240
Curing time Min@25ºC 30~60 Visual
Temperature Range ºC -40~180 -
Thermogravimetric Loss % 1 @150ºC/24H
 

FAQ

Mobile Hard Disk Phone Thermal Gap Filler

About Us

Mobile Hard Disk Phone Thermal Gap FillerMobile Hard Disk Phone Thermal Gap FillerMobile Hard Disk Phone Thermal Gap FillerMobile Hard Disk Phone Thermal Gap Filler
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Mobile Hard Disk Phone Thermal Gap FillerMobile Hard Disk Phone Thermal Gap FillerMobile Hard Disk Phone Thermal Gap FillerMobile Hard Disk Phone Thermal Gap FillerMobile Hard Disk Phone Thermal Gap Filler

 

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Diamond Member Since 2023

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Manufacturer/Factory & Trading Company
Number of Employees
44
Year of Establishment
2013-04-11